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T-Mobile USA · TMUS

T-Mobile USA 5.050% due July 15, 2033

ISIN US87264ACY91 · CUSIP 87264ACY9 · USD corporate bond
Coupon 5.050%
Maturity 2033-07-15
Currency USD
Years left 7.2
Identifiers
ISINUS87264ACY91
CUSIP87264ACY9
TickerTMUS
IssuerT-Mobile USA
TypeCorporate Bond
About this bond

The T-Mobile USA 5.050% bond (ISIN US87264ACY91, CUSIP 87264ACY9) is a USD-denominated corporate bond maturing on July 15, 2033. The bond pays a fixed 5.050% annual coupon, typically distributed in semi-annual installments.

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Other T-Mobile USA bonds
ISINCUSIPCouponMaturity
US87264ADE2987264ADE24.850%January 15, 2029
US87264ABS3387264ABS32.625%February 15, 2029
US87264ABT1687264ABT12.875%February 15, 2031
US87264ADS1587264ADS15.125%May 15, 2032
US87264ADF9387264ADF95.150%April 15, 2034
Bond reference data displayed on this page is compiled from publicly available sources and provided for informational purposes only. Data is not guaranteed to be current, complete, or accurate. Nothing on this page constitutes investment, tax, legal, or financial advice. Consult a qualified professional before making any investment decision. For pricing, yield, and analytics, sign in to NPTS Orbit.